Author:
Fan Zhuangjun,Wei Tong,Luo Guohua,Wei Fei
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference12 articles.
1. S. IIJIMA, Nature 354 (1991) 56.
2. K. Q. XIAO and L. C. ZHANG, J. Mater. Sci. 39 (2004) 4481.
3. Y. L. QIAO, L. CUI and Y. LIU, J. Mater. Sci. Lett. 21 (2002) 1813.
4. J. LIU, editor. “Conductive adhesives for electronics packaging”, (London, UK: Electrochemical publications, 1999) pp. 78–98.
5. Q. ZHAO, Z. GAN and Q. ZHUANG, Electroanalysis 14 (2002) 1609.
Cited by
57 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献