Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference40 articles.
1. Toriumi M, Tanaka H, Yoshida H (1994) The development of Al circuit substrate for power module. In: IMC 1994 proceedings, pp 104–109
2. Kim C-K, Sood VK, Jang G-S, Lim S-J, Lee S-J, Transmission HVDC (2009) Power conversion applications in power systems. John Wiley & Sons Ltd., New York
3. Furuhashi M, Tomohisa S, Kuroiwa T, Yamakawa S (2016) Practical applications of SiC–MOSFETs and further developments. Semicond Sci Technol 31(3):034003
4. Stevanovic L, Rowden B, Harfman-Todorovic M, Losee P, Bolotnikov A, Kennerly S, Schuetz T, Carastro F, Datta R, Tao F, Raju R, Cioffi P (2016) High performance SiC MOSFET module for industrial applications. In: Proceedings of the 28th international symposium on power semiconductor devices and ICs, pp 479–482
5. Piton M, Chauchat B, Servière JF (2018) Implementation of direct chip junction temperature measurement in high power IGBT module in operation—railway traction converter. Microelectron Reliab 88–90:1305–1310
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献