A non-destructive method for thickness measurement of thin electrospun membranes using white light profilometry

Author:

Affandi Nor Dalila Nor,Truong Yen Bach,Kyratzis Ilias Louis,Padhye Rajiv,Arnold Lyndon

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference20 articles.

1. Graham K, Schreuder-Gibson H, Gogins M (2003) Presented at INTC 2003, sponsored by INDA, Association of the Nonwoven Fabrics Industry and TAPPI, Technical Association of the Pulp & Paper Industry, Baltimore, MD, 15–18 September 2003. http://www.asia.donaldson.com/en/filtermedia/support/datalibrary/050271.pdf

2. Ramakrishna S, Fujihara K, Wee-Eong T, Thomas Y, Ma Z, Ramakrishna R (2006) Mater Today 9:40

3. Huang Z-M, Zhang Y-Z, Kotaki M, Ramakrishna S (2003) Compos Sci Technol 63:2223

4. Zhang S, Shim WS, Kim J (2009) Mater Des 30:3659

5. Barhate RS, Loong CK, Ramakrishna S (2006) J Membr Sci 283:209

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