Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets-Reference-Cited by-同舟云学术

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Electronic speckle pattern interferometry analysis of tensile tests of semihard copper sheets

Published:2001-03 Issue:1 Volume:41 Page:58-62
ISSN:0014-4851
Container-title:Experimental Mechanics
language:en
Short-container-title:Experimental Mechanics

Author:

Vial-Edwards C.,Lira I.,Martinez A.,Münzenmayer M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Aerospace Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF02323105.pdf

Reference7 articles.

1. Jones, R. andWykes, C., Holographic and Speckle Interferometry, ed ed, Cambridge University Press, Cambridge (1989).

2. Toyooka, S andGong, X.L., “Digital Speckle Pattern Interferometry for Observing the Entire Process of Plastic Deformation of a Solid Object,”Jap. J. Appl. Phys.,34,L1666-L16668 (1995).

3. Yoshida, S., Suprapedi, R., Widiastuti, R., Pardede, M., andKusnovo, A., “Direct Observation of Developed Plastic Deformation and Its Application to Nondestructive Testing,”Jap. J. Appl. Phys.,35,L854-L857 (1996).

4. Suprapedi, R. andToyooka, S., “Time-division Observation of Plastic Deformation Processes Using Digital Speckle Pattern Interferometry,”Opt. Rev.,4,284–287 (1997).

5. Gong, X.L. andToyooka, S., “Investigation of Mechanism of Plastic Deformation Process Using Digital Speckle Pattern Interferometry,” EXPERFIMENTAL MECHANICS,39,25–29 (1999).

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