Author:
Bui B. -N.,Blay J. -Y.,Bonichon F.,Bonvalot S.,Chevalier-Place A.,Coindre J. -M.,Delannes M.,Le Cesne A.,Morice P.,Ray-Coquard I.,Pautier P.,Le Péchoux C.,Stöeckle E.,Taieb S.,Bosquet L.
Publisher
Computers, Materials and Continua (Tech Science Press)
Cited by
12 articles.
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