Author:
Jang Eunsu,Ahn Hyo Min,Lee Byoung Kuk
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering
Reference17 articles.
1. Xu K, Vos R, Vereecke G, Doumen G, Fyen W, Mertens PW, Heyns MM, Vinckier C, Fransaer J (2004) Particle adhesion and removal mechanism during brush scrubber cleaning. J Vac Sci Technol B 22(6):2844–2852
2. Kern W (ed) (1993) Overview and evolution of semiconductor wafer contamination and cleaning technology. In: Handbook of semiconductor wafer cleaning technology, Noyes Publications (1993)
3. Jin Y, Ren CS, Fan QQ, Yan H, Li Z, Zhang J, Wang D (2012) Surface cleaning using an atmospheric-pressure plasma jet in O2/Ar mixtures. IEEE Trans Plasma Sci 40(10):2706–2710
4. Mishima H, Yasui T, Mizuniwa T, Abe M, Ohmi T (1989) Particle-free wafer cleaning and drying technology. IEEE Trans Semicond Manuf 2(3):69–75
5. Okamoto A, Kunyasu H, Hattori T (2006) Detection of 30–40-nm particles on bulk-silicon and SOI wafers using deep UV laser scattering. IEEE Trans Semicond Manuf 19(4):372–380
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献