1. The International Technology Roadmap for Semiconductors (2001)
2. Soule, C.A.: Future Trends in Heat Sink Design. Electronics Cooling 7(1), 18–27 (2001)
3. Kraus, A., Bar-Cohen, A.: Thermal Analysis and Control of Electronic Equipment. Hemisphere Publishing Corp. (1983)
4. Kraus, A.D., Bar-Cohen, A.: Design and Analysis of Heat Sinks. John Wiley & Sons, Inc., Chichester (1995)
5. Wong, H., Lee, T.Y.: Thermal Evaluation of a PowerPC 620 Multi-Processor in a Multi-Processor Computer. IEEE Transaction on Components, Packaging, and Manufacturing Technology – Part A 19(4), 469–477 (1996)