Author:
Shen Chunjian,Zhu Zengwei,Zhu Di,Ren Jianhua
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference20 articles.
1. Z.W. Zhu, D. Zhu, and N.S. Qu, Synthesis of Smooth Copper Deposits by Simultaneous Electroforming and Polishing Process, Mater. Lett., 2008, 62, p 1283–1286
2. H. Li, X. Li, G. Bai et al., Copper Electroforming for UV LIGA Technology, IEEE International Vacuum Electronics Conference 2014, p 245–246.
3. J.H. Ren, Z.W. Zhu, C.J. Shen et al., Abrasive-Assisted Copper Electroforming Process with Offset Anode in Sulfate bAth, Acta Armament., 2015, 36, p 1736–1742
4. S. Semboshi, Y. Sakamoto, H. Inoue et al., Electroforming of Oxide-Nanoparticle-Reinforced Copper–Matrix Composite, J. Mater. Res., 2015, 30(4), p 1–7
5. P.C. Huang, K.H. Hou, H.H. Sheu et al., Wear Properties of Ni-Mo Coatings Produced by Pulse Electroforming, Surf. Coat. Technol., 2014, 258, p 639–645
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献