Effect of Purging Gas on Wetting Behavior of Sn-3.5Ag Lead-Free Solder on Nickel-Coated Aluminum Substrate
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11665-012-0339-4.pdf
Reference17 articles.
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4. K.N. Prabhu and G. Kumar, Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates, J. Electron. Packag., 2010, 132, p 041001
5. I. Baylakoglu, S. Hamarat, H. Gokmen, and E. Meric, Case Study for High Volume Lead-Free Wave Soldering Process with Environmental Benefits, Proceedings of IEEE International Symposium Electronics and the Environment, 2005, Tubitak Mam
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