Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference28 articles.
1. A.L. Moore and L. Shi, Emerging Challenges and Materials for Thermal Management of Electronics, Mater. Today, 2014, 17(4), p 163–174.
2. R.M. German, K.F. Hens, and J.L. Johnson, Powder Metallurgy Processing of Thermal Management Materials for Microelectronic Applications, Int. J. Powder Metall., 1994, 30, p 205–214.
3. R. Mitteau, J.M. Missiaen, P. Brustolin, O. Ozer, A. Durocher, C. Ruset et al., Recent Developments Toward the Use of Tungsten as Armour Material in Plasma Facing Components, Fusion Eng. Des., 2007, 82, p 1700–1705.
4. K.S. Prasanta, K.K. Sarika Srinivas, M. Premkumar, B.J. Sreedhar, S.K. Srivastava, and D. Loganathan, Synthesis, Characterization and Densification of W-Cu Nanocomposite Powders, Int. J. Refract. Met. Hard Mater., 2011, 29, p 547–554.
5. L. Xu, M. Yan, X. Yi, J.H. Peng, W. Li, L.B. Zhang, C.H. Liu, G. Chen, and Y. Li, Influence of Copper Content on the Property of Cu-W Alloy Prepared by Microwave Vacuum Infiltration Sintering, J. Alloys Compd., 2014, 592, p 202–206.
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