A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering
Link
http://link.springer.com/content/pdf/10.1007/s10010-006-0037-1.pdf
Reference19 articles.
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3. Semeniouk V, Fleurial JP (1997) Novel high performance thermoelectric microcoolers with diamond substrates. In: Proceedings of the 1997 16th International Conference on Thermoelectrics, Dresden, 1997, pp 683–686
4. DiSalvo FJ (1999) Thermoelectric colling and power generation. Science 285:703–706
5. Simons RE, Chu RC (2000) Application of thermoelectric cooling to electronic equipment: a review and analysis. In: Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, pp 1–9
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