Author:
Yun Yong Woon,Kim Sang Woo,Kim Gwang Yoon,Kim Yoon Bae,Yun Yeo Chun,Lee Kyung Sup
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Materials Chemistry,Mechanics of Materials,Condensed Matter Physics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. L. Bosley, K.P. Slattery, D, Canestrari, and J. Trent, The International Journal of Microcircuits and Electronic Packaging, 18, 350 (1995).
2. S. Shahparnia and O.M. Ramahi, IEEE Transactions on Electromagnetic Compatibility, 46, 580 (2004).
3. S. Sali, International Conference on Computation in Electromagnetics, (IEE Publisher, 1991), p. 101.
4. S. Yoshida, M. Sato, E. Sugawara, and Y. Shimada, Journal of Applied Physics, 85, 4636 (1999).
5. K. Kondo, T. Chiba, H. Ono, and S. Yoshida, Journal of Applied Physics, 93, 7130 (2003).
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