On the Rationality of Bundled Rebate Program in Modem Chip Industry: an Analysis on Qualcomm’s Case
Author:
Publisher
Springer Science and Business Media LLC
Subject
Industrial relations
Link
http://link.springer.com/content/pdf/10.1007/s10842-019-00311-6.pdf
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1. The impacts of suppliers and mutual outsourcing on organizational forms;Canadian Journal of Economics/Revue canadienne d'économique;2023-01-24
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