Modelling Transient Heat Conduction at Multiple Length and Time Scales: A Coupled Non-Equilibrium Molecular Dynamics/Continuum Approach
Author:
Publisher
Springer Netherlands
Link
http://link.springer.com/content/pdf/10.1007/978-1-4020-9557-3_4.pdf
Reference24 articles.
1. Broughton, J.Q., Abrahams, F.F., Bernstein, N., Kaxiras, E.: Concurrent coupling of length scales: Methodology and application, Phys. Rev. B 60, 2391 (1999).
2. Curtin, W.A., Miller, R.E: Atomistic/continuum coupling in computational materials science, Modelling Simul. Mater. Sci. Eng. 11 R33–R68 (2003).
3. Gill, S.P.A., Jia, Z., Leimkuhler, B., Cocks, A.C.F.: Rapid thermal equilibration in coarsegrained molecular dynamics, Phys. Rev. B 73 184304 (2006).
4. Li, X., Weinan, E.: Multiscale modelling of the dynamics of solids at finite temperature, J. Mech. Phys. Solids 53 1650–1685 (2005).
5. Liu, W.K., Park, H.S., Qian, D., Karpov, E.G., Kadowaki, H., Wagner, G.J.: Bridging scale methods for nanomechanics and materials, Comput. Methods Appl. Mech. Engrg. 195 1407– 1421 (2006).
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Dual Variational Model of a Steady-State Thermal Conductivity Process Taking into Account Spatial Non-Locality;Herald of the Bauman Moscow State Technical University. Series Natural Sciences;2022-10
2. Variational Formulation of the Mathematical Model of Stationary Heat Conduction with Account for Spatial Nonlocality;Herald of the Bauman Moscow State Technical University. Series Natural Sciences;2022-04
3. Statistical mechanical theory for non-equilibrium systems. IX. Stochastic molecular dynamics;The Journal of Chemical Physics;2009-05-21
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3