The extension of cracks at high temperature by growth and coalescence of voids-Reference-Cited by-同舟云学术

The extension of cracks at high temperature by growth and coalescence of voids

Published:1984-05 Issue:1 Volume:25 Page:53-67
ISSN:0376-9429
Container-title:International Journal of Fracture
language:en
Short-container-title:Int J Fract

Author:

Hui Chung Yuen,Banthia Vinod

Publisher

Springer Science and Business Media LLC

Subject

Mechanics of Materials,Modeling and Simulation,Computational Mechanics

Link

http://link.springer.com/content/pdf/10.1007/BF01152749.pdf

Reference16 articles.

1. C.Y. Hui and H. Riedel,International Journal of Fracture 17 (1) (1981) 409?425.

2. C.Y. Hui, ?Steady State Crack Growth in Elastic Power-Law Creeping Material,? inSecond Symposium on Elastic Plastic Fracture, Philadelphia (1981).

3. H. Riedel and W. Wagner, inAdvances in Fracture Research, 5th International Conference on Fracture, ICF-5, Cannes (March-April 1981) 683?690.

4. J.L. Bassani and V. Vitek, ?Propagation of Cracks Under Creep Conditions,? paper presented at the 9th U.S. National Congress of Applied Mechanics Symposium on Nonlinear Fracture Mechanics.

5. J.D. Landes and J.A. Begley,A Fracture Mechanics Approach to Creep Crack Growth, ASTM STP-590 (1976) 128?148.

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