Bubble-templated Construction of Three-dimensional Ceramic Network for Enhanced Thermal Conductivity of Silicone Rubber Composites-Reference-Cited by-同舟云学术

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Bubble-templated Construction of Three-dimensional Ceramic Network for Enhanced Thermal Conductivity of Silicone Rubber Composites

Published:2021-05-20 Issue: Volume: Page:
ISSN:0256-7679
Container-title:Chinese Journal of Polymer Science
language:en
Short-container-title:Chin J Polym Sci

Author:

Li Shou-Jun,Li Jing-Chao,Ji Pei-Zhi,Zhang Wen-Feng,Lu Yong-Lai,Zhang Li-Qun

Publisher

Springer Science and Business Media LLC

Subject

Polymers and Plastics,Organic Chemistry,General Chemical Engineering

Link

https://link.springer.com/content/pdf/10.1007/s10118-021-2581-4.pdf

Reference35 articles.

1. Ren, L.; Li, Q.; Lu, J.; Zeng, X.; Sun, R.; Wu, J.; Xu, J. B.; Wong, C. P. Enhanced thermal conductivity for Ag-deposited alumina sphere/epoxy resin composites through manipulating interfacial thermal resistance. Compos. Part A: Appl. Sci. Manufact. 2018, 107, 561–569.

2. Shen, B.; Zhai, W.; Zheng, W. Ultrathin flexible graphene film: an excellent thermal conducting material with efficient EMI shielding. Adv. Funct. Mater. 2014, 24, 4542–4548.

3. Mehra, N.; Mu, L.; Ji, T.; Yang, X.; Kong, J.; Gu, J.; Zhu, J. Thermal transport in polymeric materials and across composite interfaces. Appl. Mater. Today 2018, 12, 92–130.

4. Prasher, R. Thermal interface materials: historical perspective, status, and future directions. Proc. IEEE 2006, 94, 1571–1586.

5. Hansson, J.; Nilsson, T. M.; Ye, L.; Liu, J. Novel nanostructured thermal interface materials: a review. Int. Mater. Rev. 2018, 63, 22–45.

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4. Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy;Chinese Journal of Polymer Science;2024-03-18

5. Understanding the Thermal Impedance of Silicone Rubber/Hexagonal Boron Nitride Composites as Thermal Interface Materials;Chinese Journal of Polymer Science;2023-08-22

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