Mode III fracture problem of an arbitrarily oriented crack in an FGPM strip bonded to a homogeneous piezoelectric half plane
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11012-008-9188-5.pdf
Reference15 articles.
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2. Wang BL, Noda N (2001) Thermally induced fracture of a smart functionally graded composite structure. Theor Appl Fract Mech 35:93–109
3. Li C, Weng GJ (2002) Antiplane crack problem in functionally graded piezoelectric materials. J Appl Mech Trans ASME 69:481–488
4. Ueda S (2003) Crack in functionally graded piezoelectric strip bonded to elastic surface layers under electromechanical loading. Theor Appl Fract Mech 40:225–236
5. Wang BL (2003) A mode III crack in functionally graded piezoelectric materials. Mech Res Commun 30:151–159
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