MD simulation of nanometric cutting of copper with and without water lubrication
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11431-014-5519-z.pdf
Reference23 articles.
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4. Zarudi I, Zhang L C, Swain M V. Effect of water on the mechanical response of monocrystalline silicon to repeated micro-indentation. Key Eng Mater, 2003, 233: 609–614
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