The effect of stacking fault energy on the microstructural development during room temperature wire drawing in Cu, Al and their dilute alloys-Reference-Cited by-同舟云学术

The effect of stacking fault energy on the microstructural development during room temperature wire drawing in Cu, Al and their dilute alloys

Published:1996-11 Issue:21 Volume:31 Page:5623-5630
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Varma S. K.,Caballero V.,Ponce J.,De La Cruz A.,Salas D.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01160807.pdf

Reference26 articles.

1. L. E. Murr, ?Interfacial Phenomenon in Metals and Alloys?, Reprinted by Techbooks (original publisher was Addison-Wesley Publishing Co. Herndon, VA, 1975) pp. 145?148.

2. S. K. Varma andB. G. Lefevre,Metall. Trans. A 11A (1977) 935.

3. J. D. Embury, A. S. Keh andR. M. Fisher,Trans. TMS-AIME 236 (1966) 640.

4. I. Samajdar andS. K. Varma,Mat. Sci. Engng A143 (1991) L1.

5. A. W. Thompson,Metall. Trans. A 8A (1977) 833.

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