Evaluation of the self-bonding ability of sugi and application of sugi powder as a binder for plywood
Author:
Publisher
Springer Science and Business Media LLC
Subject
Biomaterials
Link
http://link.springer.com/content/pdf/10.1007/s10086-009-1096-3.pdf
Reference13 articles.
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3. Imanishi H, Soma N, Yamashita O, Miki T, Kanayama K (2005) Effect of production conditions of wood powder on bending properties of wood powder molding material without adhesive. JSME Int J Series A 48:432–436
4. Gfeller B, Zanetti M, Properzi M, Pizzi A, Pichelin F, Lehmann M, Delmotte L (2003) Wood bonding by vibration welding. J Adhes Sci Technol 17:1573–1589
5. Xu J, Han G, Wong ED, Kawai S (2003) Development of binderless particleboard from kenaf core using steam-injection pressing. J Wood Sci 49:327–332
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