Influence of Powder-Chip Based Reinforcement on Tensile Properties and Fracture Behaviors of LM6 Aluminum Alloy
Author:
Publisher
Springer Science and Business Media LLC
Link
http://link.springer.com/article/10.1007/s12666-017-1244-1/fulltext.html
Reference31 articles.
1. Zhang P, Li Z, Liu B, Ding W, and Peng L, Mater Sci Eng A 651 (2016) 376.
2. Li D, and Ghosh A, Mater Sci Eng A 352 (2003) 279.
3. Akbari M K, Baharvandi H R, and Mirazee O, J Compos Mater 48 (2014) 3315.
4. Oh N R, Lee S K, Hwang K C, and Hong H U, Scr Mater 112 (2016) 123.
5. Sulaimn S, Sayuti M, and Samin R, J Mater Process Technol 201 (2008) 731.
Cited by 21 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effect of Self-Pouring Temperature on the Microstructural Characteristics of Al2O3-LM6 Semi-solid Cast Composite;Journal of The Institution of Engineers (India): Series D;2024-04-11
2. Friction Stir Processing of Recycled Titanium Reinforced A356 Composite Developed Through Stir Casting;Transactions of the Indian Institute of Metals;2023-12-27
3. Impact of reinforcement proportions on mechanical properties and micro-structure of modified Al2O3-LM6 cast composites synthesize at self-pouring temperature: optimization through mixture design of experiment (DoE);World Journal of Engineering;2023-11-29
4. Impact of SiC Addition on the Metallurgical and Microstructural Properties of Gravity Die Cast Composite for AA6061 Matrix;Transactions of the Indian Institute of Metals;2023-04-24
5. “Application of the DoE approach to the fabrication of cast Al2O3-LM6 composite material and evaluation of its mechanical and microstructural properties”;Materials Today: Proceedings;2023-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3