Application of Digital Image Correlation to Small Punch Test for Determination of Stress–Strain Properties

Abstract

AbstractThe analysis of the small punch test is based on the force on the moving punch and the deflection data acquired at a single point of the specimen bottom. However, the spatial distribution of stress and strain at any given instant is non-uniform and its variations with increase in punch penetration are quite complex. In this work, the digital image correlation (DIC) technique is integrated with small punch test for in-situ full field strain measurement in the bottom surface of the specimen. The DIC results reveal that with the progression of deformation, the peak equivalent plastic strain at the bottom surface shifts from the center of the specimen to a characteristic radial location, where the strain rapidly builds up and concentrates leading to instability and cracking. Combining DIC-based strain results with finite element model-based stress estimation at the characteristic radial location, a methodology for determining the stress–strain curve from small punch test is formulated and the outcomes are compared with tensile test results for four different metallic alloys.