Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys
Author:
Publisher
Springer Science and Business Media LLC
Subject
Multidisciplinary
Link
http://link.springer.com/content/pdf/10.1007/s11434-013-5695-4.pdf
Reference17 articles.
1. Yagodin D, Sidorov V, Janickovic D, et al. Density studies of liquid alloys Sn-Ag and Sn-Zn with near eutectic compositions. J Non-cryst Solids, 2012, 358: 2935–2937
2. Chen F X, Pang J H L. Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8Ag-0.7Cu solder joints. J Alloy Compd, 2012, 541: 6–13
3. Shohji I, Yoshida T, Takahashi T. Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity. Mater Sci Eng A, 2004, 366: 50–55
4. Phung V S, Fujitsuka A, Ohshima, K I. Influence of 0.03 wt.% carbon black addition on the performance of Sn-3.5Ag lead-free solder. J Electron Mater, 2012, 41: 1893–1897
5. Garnier T, Finel A, Bouar Y L, et al. Simulation of alloy thermodynamics: From an atomic to a mesoscale Hamiltonian. Phys Rev B, 2012, 86: 054103
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2. Local order and dynamic properties of liquid Ag -Sn1− alloys by ab initio molecular dynamics;Journal of Non-Crystalline Solids;2017-10
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