The dielectric properties of glass-ceramic-on-metal substrates for microelectronics packaging-Reference-Cited by-同舟云学术

The dielectric properties of glass-ceramic-on-metal substrates for microelectronics packaging

Published:1991 Issue:19 Volume:26 Page:5367-5373
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Thorp J. S.,Akhtaruzzaman M.,Logan E. A.,Holland D.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01143234.pdf

Reference17 articles.

1. E. A. Logan, D. Holland, J. S. Thorp andG. Partridge, in ?Proceedings of IEEE (IEMT) European Manufacturing Technology Symposium?, Paris, France (1988) p. 4.

2. G. Partridge, C. A. Elyard andM. I. Budd, in ?Glass and Glass-ceramics?, edited by M. H. Lewis (Chapman and Hall, London, 1988) Ch. 7, p. 226.

3. D. R. Bridge, D. Holland andP. W. McMillan,Glass Technol. 26 (1985) 286.

4. J. S. Thorp, M. Akhtaruzzaman andD. Evans,J. Mater. Sci. 25 (1990) 4143.

5. J. S. Thorp, D. Evans, M. Al-Naief andM. Akhtar-Uzzaman,ibid. 25 (1990) 4965.

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