Interdiffusion in the copper-rich solid solutions of Cu-Ga and Cu-Mg alloys-Reference-Cited by-同舟云学术

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Interdiffusion in the copper-rich solid solutions of Cu-Ga and Cu-Mg alloys

Published:1989-08 Issue:8 Volume:8 Page:882-884
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:J Mater Sci Lett

Author:

Takahashi T.,Yamane T.,Minamino Y.,Kimura T.

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01729933.pdf

Reference8 articles.

1. Y. TANAKA, Y. YOSHIDA, T. ASANO and K. TACIKAWA,J. Jpn. Inst. Met. 46 (1982) 413.

2. M. WILHELM,Z. Naturforsch. A 29 (1974) 733.

3. I. B. BOROVSKIY, I. D. MARCHUKOVA and Y. U. UGASTE,Izv. Vyssh. Uchebn. Zaved. Tsvetn. Metall. 1 (1977) 172.

4. A. D. LECLAIRE, “Smithells Metal Reference Book”, edited by E. A. Brandes (Butterworths, London, 1983) pp. 13–61.

5. H. SOEJIMA, “Electron Probe Micro Analyzer” (Niikan Kogyo Newspaper Co., Tokyo, 1987) p. 338.

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