Thermal expansion coefficients of doped and undoped silica prepared by means of PCVD-Reference-Cited by-同舟云学术

Thermal expansion coefficients of doped and undoped silica prepared by means of PCVD

Published:1988-07 Issue:7 Volume:23 Page:2584-2588
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Bachmann P. K.,Wiechert D. U.,Meeuwsen T. P. M.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF01111918.pdf

Reference16 articles.

1. P. Geittner, D. Küppers andH. Lydtin,Appl. Phys. Lett. 18 (1976) 645.

2. P. Bachmann,Pure Appl. Chem. 57 (1985) 1299.

3. P. Bachmann, P. Geittner andH. Lydtin, ?Technical Digest, Conference on Optical Fiber Communications? (Optical Society of America, Washington, D.C., 1986) paper WA1, p. 76.

4. P. Bachmann, H. Hübner, M. Lennartz, E. Steinbeck andJ. Ungelenk, 8th European Conference on Optical Communications, Cannes, France, Conference Proceedings (1982) p. 66.

5. P. K. Bachmann, P. Geittner, D. Leers andH. Wilson,J. Lightwave Technol. LT-4 (1986) 813.

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