Aluminum films deposited by rf sputtering-Reference-Cited by-同舟云学术

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Aluminum films deposited by rf sputtering

Published:1970-03 Issue:3 Volume:1 Page:725-732
ISSN:1073-5615
Container-title:Metallurgical and Materials Transactions B
language:en
Short-container-title:Metall and Materi Trans B

Author:

D’Heurle F. M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02811600.pdf

Reference21 articles.

1. P. D. Davidse and L. I. Maisse:J. Appl. Phys., 1966, vol. 37, pp. 574–79.

2. J. L. Vossen and J. J. O’Neil:R. C. A. Rev., 1968, vol. 29, pp. 149–79.

3. I. H. Pratt:Trans. TMS-AIME, 1968, vol. 242, pp. 526–31.

4. F. d’Heurle:Trans. TMS-AIME, 1966, vol. 236, pp. 321–26.

5. P. D. Davidse:Vacuum, 1967, vol. 17, pp. 139–45.

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