Effect of heat treatment on the interfacial microstructure and properties of Cu-Al joints-Reference-Cited by-同舟云学术

Effect of heat treatment on the interfacial microstructure and properties of Cu-Al joints

Published:2016-11-07 Issue:1 Volume:61 Page:187-196
ISSN:0043-2288
Container-title:Welding in the World
language:en
Short-container-title:Weld World

Author:

Wang Xue-Gang,Li Xin-Geng,Yan Feng-Jie,Wang Cheng-Guo

Funder

State Grid Corporation of China

state grid corporaton of China

state grid corporation of China

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

http://link.springer.com/content/pdf/10.1007/s40194-016-0393-x.pdf

Reference21 articles.

1. Braunovic M (2007) Reliability of power connections. Journal of Zhejiang University Science A 8:343–356

2. Abbasi M, Karimi Taheri A, Salehi MT (2001) Growth rate of intermetallic compounds in Al Cu bimetal produced by cold roll welding process. J Alloys Compd 319:233–241

3. Lee WB, Bang KS, Jung SB (2005) Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing. J Alloys Compd 390:212–219

4. Braunovic M, Aleksandrov N (1992) Intermetallic compounds at aluminum-to-copper and copper-to-tin electrical interfaces. Proceeding of the 38th IEEE Holm Conference of Electrical Contacts 1.2:25–34

5. Dixon CD, Nelson FG (1960) The effect of elevated temperature on flash-welded aluminum-copper joints. Trans AIEE II 78:491–495

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