Funder
key special projects of the national key R&D program
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference49 articles.
1. Kumar L, Limaye K (2003) Review of progress in indigenous design, development & production of microwave vacuum-electronic devices. IETE Tech Rev 20:75–93
2. Gamzina D, Kozina M, Mehta A, Nanni EA, Tantawi S, Welander PB, Horn T, Ledford C (2019) Copper reconsidered: material innovations to transform vacuum electronics. International Vacuum Electronics Conference (IVEC);
3. Wu M, He XB, Rafi UD, Ren SB, Qin ML, Qu XH (2009) Effect of various Ni plating layers and aging on microstructure and shear strength of Sn-2.5Ag-2.0Ni solder joint. Surf Coating Technol 203:3011–3018
4. Lu JB, Mu YC, Luo XW, Niu JT (2012) A new method for soldering particle-reinforced aluminum metal matrix composites. Mater Sci Eng B 177:1759–1763
5. Clarke DR, Gee ML (1992) Wetting of surfaces and grain boundaries. Materials interfaces (UK). ed. D. Wolf and S. Yip. Chapman & Hall, London 255–272.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献