Influence of different surface conditions on mechanical properties during ultrasonic welding of aluminum wire strands and copper terminals

Abstract

AbstractUltrasonic metal welding (USMW) has become considerable attention in terms of its suitable applications compared to conventional fusion welding techniques. The main advantage of USMW results from the comparatively low process times and joining temperatures below the melting point. Thus, USMW is particularly used for the joining of dissimilar material combinations, e.g., aluminum and copper (Al/Cu), in battery cell production or wiring harness applications. However, process fluctuations in USMW of Al/Cu joints can occur due to varying surface conditions of the joining materials. Therefore, this study investigated different surface conditions of copper terminals and their effects on mechanical properties. At first, three different surface conditions were generated, respectively: surface cleaning (sulfuric acid and ethanol), structuring process by laser, and structuring process by milling. These modifications are compared with the terminals in the initial state (contaminated). The characterization of the terminal surfaces was carried out with 3-D laser scanning microscopy as well as light microscopy. The mechanical conditions were examined with shear tensile tests. The tensile tests showed a significant influence of the surface condition on the resulting failure loads compared to the initial state. The highest failure loads could be achieved with the structured terminals (+ 48%), whereas contaminated terminals and terminals with notches exhibited comparatively poor failure loads (− 28%). This can be explained by varying interface formations between the terminal and the wire, which was detected by metallography and SEM analysis. Furthermore, it was figured out that the interface between aluminum and copper exhibits a firm and formed closure bond and hence increased failure loads for laser-structured terminals. Additional investigations by SEM revealed no detectable occurrence of intermetallic phases.