Author:
Li Dan,Fu Huaqiang,Wang Ling,Wan Chao,Li Shan,Song Zhipeng,Zhang Jian,Xiao Yong
Funder
National Natural Science Foundation of China
Guangzhou Science and Technology Plan Project
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Cited by
3 articles.
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1. Ultrasonic-assisted soldering of Al alloy using a novel Ni mesh reinforced Sn-9Zn solder;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Direct soldering of 5A06 Al alloy using a Ti alloy mesh reinforced SAC305 composite solder;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Review of ultrasonic-assisted soldering in Sn-based solder alloys;Journal of Materials Science: Materials in Electronics;2023-03