The effect of moisture on the mechanical response of wood, adhesive and their interphase by means of nanoindentation

Author:

Rindler AxelORCID,Hansmann Christian,Konnerth Johannes

Funder

Österreichische Forschungsförderungsgesellschaft

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Plant Science,General Materials Science,Forestry

Reference47 articles.

1. Brockmann W, Geiß PL, Klingen J, Schröder KB (2008) Adhesive bonding: materials, applications and technology. Wiley, Weinheim

2. CSM Instruments (2002) Overview of mechanical testing standards. Advanced mechanical surface testing, Appl. Bull 18, Peseux

3. Dunky M, Niemz P (2013) Holzwerkstoffe und Leime: Technologie und Einflussfaktoren (Wood-based panels and glues: technology and influencing factors). Springer, Berlin. https://doi.org/10.1007/978-3-642-55938-9

4. Eckmann R (2007) Charakterisierung der Adhäsiven, Kohäsiven und mechanischen Eigenschaften der Klebfuge in einer Holzverklebung. (Characterisation of adhesive, cohesive and mechanical properties in the glue line of wood bondings). Dissertation, University of Natural Resources and Life Science Vienna

5. Frihart CR (2004)Adhesive interactions with wood. In: Fundamentals of composite processing: proceedings of a workshop, 5–6 Nov 2003. Madison, WI, US Department of Agriculture, Forest Service, Forest Products Laboratory, 2004. General technical report FPL; FPL-GTR-149, pp 29–38

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