Image-based microstructural simulation of thermal conductivity for highly porous wood fiber insulation boards

Author:

Andrä Heiko,Dobrovolskij Dascha,Engelhardt Max,Godehardt Michael,Makas Michael,Mercier Christian,Rief Stefan,Schladitz KatjaORCID,Staub Sarah,Trawka Karol,Treml Sebastian

Abstract

AbstractThe thermal conductivity of wood fiber insulation boards is significantly influenced by the microstructure of the fiber network and in general, the efficiency of wood fiber insulation boards increases with porosity. For higher raw densities, the raw density is a good predictor for the thermal conductivity. For lower raw densities however, this simple relation does not hold anymore. Here, structural information gained from 3D computed tomography images at several scales, modeling of the microstructure, and numerical simulation of the thermal conductivity are combined to get deeper insight into which and how microstructural features influence the thermal conductivity. The model-based simulation as described here shows that the presence and orientation of wood fiber clusters impact the thermal conductivity significantly.

Funder

Bundesministerium für Verbraucherschutz, Ernährung und Landwirtschaft

Fraunhofer-Institut für Techno- und Wirtschaftsmathematik ITWM

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Plant Science,General Materials Science,Forestry

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