Effect of molecular weight of urea–formaldehyde resins on their cure kinetics, interphase, penetration into wood, and adhesion in bonding wood-Reference-Cited by-同舟云学术

Effect of molecular weight of urea–formaldehyde resins on their cure kinetics, interphase, penetration into wood, and adhesion in bonding wood

Published:2019-04-06 Issue:3 Volume:53 Page:665-685
ISSN:0043-7719
Container-title:Wood Science and Technology
language:en
Short-container-title:Wood Sci Technol

Author:

Jeong Bora,Park Byung-Dae^ORCID

Funder

National Research Foundation

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Plant Science,General Materials Science,Forestry

Link

http://link.springer.com/content/pdf/10.1007/s00226-019-01092-1.pdf

Reference40 articles.

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2. de Jong JI, de Jonge J, Eden HAK (1953) The formation of trihydroxymethyl urea. Rec Trav Chim Pays-Bas 72:88–90

3. Dunky M (1998) Urea–formaldehyde (UF) adhesive resins for wood. Int J Adhes Adhes 18(2):95–107

4. Ellis S (1993) The performance of waferboard bonded with powdered phenol-formaldehyde resins with selected molecular weight distributions. For Prod J 43(2):66–68

5. Fan D, Li J, Mao A (2006) Curing characteristics of low mole ratio urea–formaldehyde resins. J Adhes Interface 7(4):45–52

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