The effects of wire geometry and wire layout on wire sweep performance using LQFP packages in transfer mold-Reference-Cited by-同舟云学术

The effects of wire geometry and wire layout on wire sweep performance using LQFP packages in transfer mold

Published:2014-09 Issue:9 Volume:15 Page:1793-1799
ISSN:2234-7593
Container-title:International Journal of Precision Engineering and Manufacturing
language:en
Short-container-title:Int. J. Precis. Eng. Manuf.

Author:

Ali Siti Sofiyah Skh,Hian Serene Teh Seoh,Ang Bee Chin

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s12541-014-0531-6.pdf

Reference12 articles.

1. Chew, S. and Tan, A. C., “Evaluating the Influence of Post-Mould Cure and Additives on the Viscoelastic Properties of a Low Stress Epoxy Mould Compound,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 26, No. 3, pp. 211–215, 2003.

2. Lu, D. and Wong, C. P., “Materials for Advanced Packaging,” Springer, pp. 343–344, 2010.

3. Teh, S. S. H., Low, B. Y., Foong, C. S., and Siong, C. T., “Wire Sweep Characterization of Multi-Tier Copper Wire Bonding on Thermally-Enhanced Plastic Ball Grid Array Packages,” Proc. of 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium, pp. 1–5, 2010.

4. Kung, H. K. and Chen, H. S., “The Equivalent Diameter of Copper Wire and Gold Wire based on the Sweep Stiffness Evaluation in Semiconductor Packaging,” Proc. of 11th Electronics Packaging Technology Conference, pp. 21–26, 2009.

5. Hian, S. T. S., Seng, F. C., Kiong, T. S., and Kalandar, N. K. O., “Wire Diameter and Length Effects on Wire Sweep Performance of Multi-Tier Copper and Gold Wire Bonding in Plastic Ball Grid Array Packages,” Proc. of IEEE 13th Electronics Packaging Technology Conference, pp. 764–768, 2011.

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