Design and Control of a Flexure-Based Dual Stage Piezoelectric Micropositioner

Author:

Zarrabi Ekbatani RominaORCID,Zheng Jinchuan,Chen Xiaoqi,Nikzad Mostafa,Man Zhihong

Abstract

AbstractIn the field of advanced manufacturing technology, there is a growing need for high-precision micro/nano positioners. The traditional single stage actuated positioners have encountered performance limitation in achieving longer travel range and higher precision. This motivates us to develop a novel dual stage piezoelectric-actuated micropositioner presented in this paper. The micropositioner incorporates displacement amplification mechanisms to overcome the limited range of piezoelectric actuators. Design considerations such as flexure characteristics and material selection are discussed, and structural analysis is performed using finite element analysis (FEA). For precise positioning, the dual stage control strategy is investigated and compared with the conventional proportional-integral-derivative (PID) single stage control method. In the proposed positioner, a combination of parallelogram and bridge mechanisms is utilized. The bridge mechanism works to amplify the piezoelectric actuator displacement output. The parallelogram mechanism, integrated within the system, helps mitigate resonance modes and contributes to the achievement of linearized motion. The characteristics of the micropositioner were evaluated using analytical modelling and FEA. Multiple analysis was used to optimise the positioner’s design parameters. Furthermore, experimental studies were carried out to validate the characteristics of the micropositioner performance in terms of achievable output travel range and sustained positioning accuracy.

Funder

Swinburne University of Technology

Publisher

Springer Science and Business Media LLC

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Development of a piezoelectric resonator with in-plane displacement-amplification mechanism;Microsystem Technologies;2024-08-12

2. Development of Wafer Bonding System for High Precision Bonding Alignment;International Journal of Precision Engineering and Manufacturing;2024-08-06

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