Author:
Shin Bonghun,Kwon Hyock-Ju,Han Sang-Wook,Im Chang Min
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Reference21 articles.
1. Shin, B., Jeon, S., Lee, J., Han, C. S., Im, C. M., and Kwon, H.-J., “Controlled Trigger and Image Restoration for High Speed Probe Card Analysis,” Int. J. Precis. Eng. Manuf., Vol. 16, No. 4, pp. 661–667, 2015.
2. Iwai, H., Nakayama, A., Itoga, N., and Omata, K., “Cantilever Type Probe Card for At-Speed Memory Test on Wafer,” Proc. of IEEE 23rd VLSI Test Symposium, pp. 85–89, 2005.
3. Comeau, A. R. and Nadeau, N., “Modeling the Bending of Probes Used in Semiconductor Industry,” IEEE Transactions on Semiconductor Manufacturing, Vol. 4, No. 2, pp. 122–127, 1991.
4. Sasho, S. and Sakata, T., “Four Multi Probing Test for 16 Bit Dac with Vertical Contact Probe Card,” Proc. of IEEE Test Conference, pp. 86–91, 1996.
5. Chang, H.-Y., Pan, W.-F., and Lin, S.-M., “Investigation of Contact Behavior and Design of Vertical Probe for Wafer Level Probing,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No. 4, pp. 710–718, 2012.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献