Simulation Study on Removal Mechanism of Si3N4 Ceramic in Rotary Ultrasonic Grinding-Reference-Cited by-同舟云学术

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Simulation Study on Removal Mechanism of Si3N4 Ceramic in Rotary Ultrasonic Grinding

Published:2023-04-21 Issue:6 Volume:24 Page:945-965
ISSN:2234-7593
Container-title:International Journal of Precision Engineering and Manufacturing
language:en
Short-container-title:Int. J. Precis. Eng. Manuf.

Author:

Wei Shiliang,Zhang Tao,Wei Hengju,Wang Wei,Wang Haiyang,Liu Youdi

Funder

Program for Top 100 Innovative Talents in Colleges and Universities of Hebei Province

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Link

https://link.springer.com/content/pdf/10.1007/s12541-023-00808-5.pdf

Reference24 articles.

1. Cho, Y., Hwang, J., Park, M. S., et al. (2022). Fabrication methods for Microscale 3D structures on Silicon Carbide. International Journal of Precision Engineering and Manufacturing, 23(12), 1477–1502.

2. Zhang, Z., Shi, K., Huang, X., et al. (2022). Development of a probabilistic algorithm of surface residual materials on Si3N4 ceramics under longitudinal torsional ultrasonic grinding. Ceramics International, 48(9), 12028–12037.

3. Kumar, K., Kim, M. J., Park, Y. J., et al. (2022). Twofold increase in Weibull modulus of hot-pressed Si3N4 ceramic by modified pressing profile. Materials Today Communications, 32, 103979.

4. Su, C., Tang, H., Guo, P., et al. (2022). Study on mechanism of chip formation of grinding plasma-sprayed alumina ceramic coating. Ceramics International.

5. Qiao, G., Yi, S., Zheng, W., et al. (2022). Material removal behavior and crack-inhibiting effect in ultrasonic vibration-assisted scratching of silicon nitride ceramics. Ceramics International, 48(3), 4341–4351.

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