Micro-rolling Forming of Light Extraction Structure on Substrate for LED Chip-on-Board Package
Author:
Funder
National Natural Science Foundation of China
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Link
https://link.springer.com/content/pdf/10.1007/s12541-020-00372-2.pdf
Reference25 articles.
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3. Lin, C., Liu, B., Li, X., Shen, Y. & Lin, Z. (2014). A sandwich structure of multi-chip COB LED with double flat glass boards coated with phosphors film by screen printing technique. In 2014 15th International Conference on Electronic Packaging Technology (ICEPT) (pp. 1486–1490).
4. Joo, J. Y., & Lee, S. K. (2009). Miniaturized tir fresnel lens for miniature optical led applications. International Journal of Precision Engineering and Manufacturing, 10(2), 137–140.
5. Yu, X., Xie, B., Shang, B., Chen, Q., & Luo, X. (2016). A cylindrical tuber encapsulant geometry for enhancing optical performance of chip-on-board packaging light-emitting diodes. IEEE Photonics Journal, 8(3), 1–9.
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