Thermal Performance Evaluation of Micro Pin–Fin Heat Exchangers: Part II—Numerical Simulation and Fabrication Demonstration
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering
Link
https://link.springer.com/content/pdf/10.1007/s12541-023-00926-0.pdf
Reference42 articles.
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2. Kim, T., Han, Y.-S., You, H., Kim, C., Kim, M., Choi, B.-I., & Do, K. H. (2023). Pressure drop and thermal resistance characteristics of plain-fin heat sink with impingement flow. International Journal of Thermal Sciences, 194, 108598. https://doi.org/10.1016/j.ijthermalsci.2023.108598
3. Babar, H., Wu, H., Ali, H. M., & Zhang, W. (2023). Hydrothermal performance of inline and staggered arrangements of airfoil shaped pin-fin heat sinks: A comparative study. Thermal Science and Engineering Progress, 37, 101616. https://doi.org/10.1016/j.tsep.2022.101616
4. Bantulu, C., & Albarbar, A. (2016). Real-timesystem for monitoring the electro-thermal behaviour of power electronic devices used in boost converters. Microeletronics Reliability, 62, 82–90. https://doi.org/10.1016/j.microrel.2016.03.033
5. Jung, D., Lee, H., Kong, D., Cho, E., Jung, K. W., Kharangate, C. R., Iyengar, M., Malone, C., Asheghi, M., Goodson, K. E., & Lee, H. (2021). Thermal design and management of micro-pin fin heat sinks for energy-efficient three-dimensional stacked integrated circuits. International Journal of Heat and Mass Transfer, 175, 121192. https://doi.org/10.1016/j.ijheatmasstransfer.2021.121192
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