A study on thermal characteristics of micro-scale grinding process using nanofluid minimum quantity lubrication (MQL)

Author:

Lee Pil-Ho,Lee Sang Won,Lim Se-Hwa,Lee Soo-Hong,Ko Han Seo,Shin Seung-Won

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering

Reference30 articles.

1. Buttery, T. C. and Archard, J. F., “Grinding and Abrasive Wear,” Proceedings of the Institution of Mechanical Engineers, Vol. 185, No. 1, pp. 537–551, 1970.

2. Malkin, S. and Anderson, R., “Thermal Aspects of Grinding: Part 1 — Energy Partition,” Journal of Manufacturing Science and Engineering, Vol. 96, No. 4, pp. 1177–1183, 1974.

3. Malkin, S., “Thermal Aspects of Grinding: Part 2 — Surface Temperatures and Workpiece Burn,” Journal of Manufacturing Science and Engineering, Vol. 96, No. 4, pp. 1184–1191, 1974.

4. Rowe, W. B., Pettit, J. A., Boyle, A., and Moruzzi, J. L., “Avoidance of Thermal Damage in Grinding and Prediction of the Damage Threshold,” CIRP Annals-Manufacturing Technology, Vol. 37, No. 1, pp. 327–330, 1988.

5. Klocke, F. and Eisenblätter, G., “Dry Cutting,” CIRP Annals-Manufacturing Technology, Vol. 46, No. 2, pp. 519–526, 1997.

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