Effect of oxygen partial pressure on tungsten-alumina bonding behaviour-Reference-Cited by-同舟云学术

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Effect of oxygen partial pressure on tungsten-alumina bonding behaviour

Published:1992 Issue:23 Volume:11 Page:1602-1604
ISSN:0261-8028
Container-title:Journal of Materials Science Letters
language:en
Short-container-title:J Mater Sci Lett

Author:

Park Jeong Hyung,Lee Sang Jin

Publisher

Springer Science and Business Media LLC

Subject

General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00740846.pdf

Reference10 articles.

1. A. G. PINCUS,J. Amer. Ceram. Soc. 36 (1953) 152.

2. S. S. COLE and G. SOMMER, ibid.44 (1961) 265.

3. K. OTSUKA, T. USAMI and M. SEKIHATA,Amer. Ceram. Soc. Bull. 60 (1981) 540.

4. A. HAYDUK and K. BERGER,Solid St. Technol. (September 1986) 135.

5. A. BETTINELLI, in ?High tech ceramics?, edited by P. Vincenzini (Elsevier Science, Amsterdam, 1987) p. 1567.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Bonding behavior of Cu/CuO thick film on a low-firing ceramic substrate;Journal of Materials Research;1997-09

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