1. Liwei Lin, “MEMS Post-Packaging by Localized Heating and Bonding,” IEEE Trans. on Advanced Packaging, Vol 23, pp. 608–616, Nov. 2000.
2. Liwei Lin, Y.T. Cheng and K. Najafi, “Formation of Silicon-Gold Eutectic Bond Using Localized Heating Method,” Japanese Journal of Applied Physics, Part II, Vol. 11B, pp. 1412–1414,Nov. 1998.
3. Y.T. Cheng, Liwei Lin and Khalil Najafi, “Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and Packaging,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 9, pp. 3–8, March 2000.
4. Y.T. Cheng, W.T. Hsu, Liwei Lin, C.T. Nguyen and K. Najafi, “Vacuum Packaging Technology Using Localized Aluminum/Silicon-to Glass Bonding,” Proceedings of IEEE Micro Electro Mechanical Systems Conference, pp. 18–21, Jan. 2001, Interlaken, Switzerland.
5. G.H. He, Liwei Lin and Y.T. Cheng, “Localized CVD Bonding for MEMS Packaging,” 10th Int. Conference on Solid State Sensors and Actuators, Transducer’s 99, Technical Digest, Sendai, Japan, June 1999, pp. 1312–1315.