Machine Vision-Aided Quality Decision System for Solder Joint Defect Evaluation
Author:
Publisher
Springer Berlin Heidelberg
Link
http://link.springer.com/content/pdf/10.1007/978-3-642-37270-4_14
Reference13 articles.
1. Chu CC, Jiang BC, Wang CC (2008) Modified gamma correlation method to enhance BGA surface image for surface defect inspection. Int J Prod Res 46(8):2165–2178
2. Jiang BC, Wang YM, Wang CC (2001) Bootstrap sampling techniques applied to PCB golden fingers defect classification study. Int J Prod Res 39(10):2215–2230
3. Jiang BC, Tasi SL, Wang CC (2002) Machine-vision based grey relational theory applied to IC marking inspection. IEEE Trans Semicond Manuf 15(4):531–539
4. Jiang BC, Wang CC, Chen PL (2004) Logistic regression tree applied to classify PCB golden finger defects. Int J Adv Manuf Technol 24(7):496–502
5. Jiang BC, Wang CC, Hau YN (2007) Machine vision and background remover-based approach for PCB solder joints inspection. Int J Prod Res 45(2):451–464
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