Physical Design Issues in 3-D Integrated Technologies

Author:

Pavlidis Vasilis F.,Friedman Eby G.

Publisher

Springer Berlin Heidelberg

Reference63 articles.

1. International Technology Roadmap for Semiconductors (ITRS), Semiconductor Industry Association (2007)

2. Pavlidis, V.F., Friedman, E.G.: Three Dimensional Integrated Circuit Design. Morgan Kaufmann Publishers, San Francisco (2009)

3. Joyner, J.W., et al.: Impact of Three-Dimensional Architectures on Interconnects in Gigascale Integration. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 9(6), 922–928 (2001)

4. Rahman, A., Reif, R.: System Level Performance Evaluation of Three-Dimensional Integrated Circuits. IEEE Transactions on Very Large Scale Integration (VLSI) Systems 8(6), 671–678 (2000)

5. Stroobandt, D., Van Campenhout, J.: Accurate Interconnection Lengths in Three-Dimensional Computer Systems. IEICE Transactions on Information and System, Special Issue on Physical Design in Deep Submicron 10(1), 99–105 (2000)

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