Publisher
Springer Berlin Heidelberg
Cited by
2 articles.
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1. Application oriented On-The-Edge Capable Prognostic and Health Monitoring Framework for Solder Joints in Electronics;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
2. Sensortechnik;Handbuch Mensch-Roboter-Kollaboration;2019