Author:
Wane Sidina,Bajon Damienne
Publisher
Springer Berlin Heidelberg
Reference52 articles.
1. R.R. Tummala, SOP: What is it and why? A new microsystem-integration technology Paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade. Trans. Adv. Packaging 27(2), 241–247 (2004)
2. J. Mao, G. Fitzgerald, A. Kuo, S. Wane, Coupled analysis of quasi-static and full-wave solution towards IC, package and board co-design. in IEEE 2007 Electrical Performance of Electronic Packaging, 111–114 (2007)
3. S. Wane, Partition and global methodologies for IC, package and board co-simulation in SiP applications. in European Microwave Integrated Circuit Conference Proceedings, EuMIC 2007, 451–454 (2007)
4. S. Wane, A. Kuo, Electromagnetic and thermal co-analysis for distributed co-design and co-simulation of chip, package and board, in Proceedings of the IEEE-RFIC 2008 Radio Frequency Integrated Circuit Symposium Digest, 471–474 (2008)
5. S. Wane, G. Boguszewski, Global digital-analog co-simulation methodology for powerand signal integrity aware design and analysis. in Proceedings of the 38th European Microwave Conference,Amsterdam, Oct. 2008