Hybridization of Cooled Mosaic Sensors by Indium-Bumps-Reference-Cited by-同舟云学术

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Hybridization of Cooled Mosaic Sensors by Indium-Bumps

Published:1990 Issue: Volume: Page:429-434
ISSN:
Container-title:Micro System Technologies 90
language:
Short-container-title:

Author:

Plötner M.,Blasek G.,Sadowski G.,Rzepka S.

Publisher

Springer Berlin Heidelberg

Link

http://link.springer.com/content/pdf/10.1007/978-3-642-45678-7_61.pdf

Reference7 articles.

1. Rode, J.P.: Hybrid HgCdTe Arrays, SPIE 443(1983), 120.

2. Zanio, K.R., Bean, R.C.: HgCdTe photovoltaic detectors on Si substrates, SPIE 930(1988), 44.

3. Watton, R.: Technology and performance for linear and two dimensional pyroelectric arrays, SPIE 510(1984), 139.

4. Plötner, M. u.a.: Mechanik von In-Loten bis zu tiefen Temperaturen, 4. Tagg. Elektroniktechnologie, Berlin 1990.

5. Plötner, M. u.a.: In-bump Technologie sur Hybridisierung gekühlter matrixförmiger Sensoren, 4. Tagg. Elektroniktechnologie, Berlin 1990.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis;Journal of Electronic Packaging;2024-02-28

2. Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors;Microelectronics International;1991-02

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