Publisher
Springer Berlin Heidelberg
Reference39 articles.
1. Ang, X.F., Lin, A.T., Wei, J., Chen, Z., Wong, C.C.: Low temperature copper–copper thermocompression bonding. In: Proceedings of the 10th Electronics Packaging Technology Conference (EPTC), pp. 399–404. Singapore (2008)
2. Aryasomayajula, L., Rieske, R., Wolter, K.J.: Application of copper-carbon nanotubes composite in packaging interconnects. In: Proceedings of the 34th International Spring Seminar on Electronics Technology (2011)
3. Beelen-Hendrikx, C.: Trends in IC packaging. In: Proceedings of the 17th European Microelectronics and Packaging Conference (EMPC), pp. 1–8. Rimini, Italy (2009)
4. Beica, R.: Advanced metallization for 3D integration. In: Proceedings of the 10th Electronics Packaging Technology Conference, pp. 212–218. Singapore (2008)
5. Beyne, E.: The rise of the 3rd dimension for system integration. In: Proceedings of the 9th International Interconnect Technology Conference, pp. 1–5. Burlingame, USA (2006)
Cited by
10 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献