Survivability of MEMS Packages at High-g Loads

Author:

Pryputniewicz Ryszard J.

Publisher

Springer Berlin Heidelberg

Reference8 articles.

1. Karnick, D., Ballas, G., Koland, L., Secord, M., Braman, T., Kourepenis, T.: Honeywell gun-hard inertial measurement unit (IMU) development. In: Position Location and Navigation Symposium, PLANS, vol. 4, pp. 49–55 (2004)

2. Brown, T.G.: Harsh military environments and microelectromechanical (MEMS) devices. Proc. IEEE Sensors 2, 753–760 (2003)

3. Marinis, T.F., Soucy, J.W., Lawrence, J.G., Marinis, R.T., Pryputniewicz, R.J.: Vacuum sealed MEMS package with an optical window. In: IEEE Electronics Components and Technology Conference (ECTC), Orlando, FL, pp. 804–810 (2008)

4. Klempner, A.R.: Development of a modular interferometric microscopy system for characterization of MEMS. MS Thesis, Worcester Polytechnic Institute, Worcester, MA (2006)

5. Marinis, R.T.: Development and implementation of automated interferometric microscope system for study of MEMS inertial sensors. Ph.D. Dissertation, Worcester Polytechnic Institute, Worcester, MA (2009)

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